| PART |
Description |
Maker |
| 557T186XM 557S186XM |
Composite D-Subminiature EMI/RFI Banding Split Backshell
|
Glenair, Inc.
|
| 319FW136XM20 319FW136XM22 319FW136XM24 319FW136XM2 |
Composite EMI/RFI Shield Sock
|
Glenair, Inc.
|
| 507T088XM51B04SK 507T088XM09B04 507T088XM09B04SK 5 |
Composite RFI/EMI Banding Backshell
|
Glenair, Inc.
http://
|
| 447AW711XM08 447AW711XM10 447AW711XM14 447AW711XM1 |
Composite EMI/RFI Banding Backshell with Strain Relief
|
Glenair, Inc.
|
| 319HT134XM08P 319HT134XM10P 319HT134XM12P 319HT134 |
Composite EMI/RFI Ultra Low-Profile Shield Sock
|
Glenair, Inc.
|
| 507T088XM51B04 507S088XM51B04 507E088XM51B04 507T0 |
Micro-D Backshells EMI, Composite, Round Cable Entry 507-088
|
Glenair, Inc.
|
| 557S110M 557E110M |
EMI/RFI D-Subminiature Solid Backshell
|
Glenair, Inc.
|
| 713-356 |
Composite Self-Locking EMI/RFI Environmental Connector Adapter for Series 72 Annular Convoluted Tubing
|
Glenair, Inc.
|
| 550E003M 550T003M |
EMI/RFI D-Subminiature Strain-Relief Split Backshell
|
Glenair, Inc.
|
| XN04210 XN4210 UN1210 UNR1210 |
Composite Device - Composite Transistors
Silicon NPN epitaxial planer transistor
|
PANASONIC[Panasonic Semiconductor]
|
| XN0121M |
Composite Device - Composite Transistors 复合设备-复合晶体
Silicon NPN epitaxial planar type
|
Panasonic Industrial Solutions
Panasonic Semiconductor
|
